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 Dual N-Channel Enhancement Mode Field Effect Transistor FEATURES
20V, 7A, RDS(ON) = 22m @VGS = 4.5V. RDS(ON) = 32m @VGS = 2.5V. Super high dense cell design for extremely low RDS(ON). High power and current handing capability. Lead free product is acquired. Surface mount Package. ESD Protected: 2000 V
D1 8 D1 7
CEM8208
5
D2 6
D2 5
SO-8 1
1 S1
2 G1
3 S2
4 G2
ABSOLUTE MAXIMUM RATINGS
Parameter Drain-Source Voltage Gate-Source Voltage Drain Current-Continuous Drain Current-Pulsed
a
TA = 25 C unless otherwise noted Symbol VDS VGS ID IDM PD TJ,Tstg Limit 20 Units V V A A W C
12
7 25 2.0 -55 to 150
Maximum Power Dissipation Operating and Store Temperature Range
Thermal Characteristics
Parameter Thermal Resistance, Junction-to-Ambient b Symbol RJA Limit 62.5 Units C/W
Details are subject to change without notice . 1
Rev 3. 2007.Jan http://www.cetsemi.com
CEM8208
Electrical Characteristics
Parameter Off Characteristics Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Body Leakage Current, Forward Gate Body Leakage Current, Reverse On Characteristics Gate Threshold Voltage Static Drain-Source On-Resistance Dynamic Characteristics c Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Switching Characteristics c Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage b td(on) tr td(off) tf Qg Qgs Qgd IS VSD VGS = 0V, IS = 7A VDS = 10V, ID =7A, VGS = 4.5V VDD = 10V, ID = 1A, VGS = 4.5V, RGEN = 6 0.34 0.68 3.58 2 4.2 1.0 2.4 1.5 1.2 0.68 1.72 7.16 4 5.6 us us us us nC nC nC A V gFS Ciss Coss Crss VDS = 10V, ID = 7A VDS = 25V, VGS = 0V, f = 1.0 MHz 14 40 115 15 S pF pF pF VGS(th) RDS(on) VGS = VDS, ID = 250A VGS = 4.5V, ID = 7A VGS = 2.5V, ID = 5.6A 0.5 18 24 1.2 22 32 V m m BVDSS IDSS IGSSF IGSSR VGS = 0V, ID = 250A VDS = 40V, VGS = 0V VGS = 12V, VDS = 0V VGS = -12V, VDS = 0V 20 1 10 -10 V
A
Tc = 25 C unless otherwise noted Symbol Test Condition Min Typ Max Units
uA uA
6
Drain-Source Diode Characteristics and Maximun Ratings
Notes : a.Repetitive Rating : Pulse width limited by maximum junction temperature. b.Pulse Test : Pulse Width < 300s, Duty Cycle < 2%. c.Guaranteed by design, not subject to production testing.
2
CEM8208
15 12 9 6 VGS=4.5,3.5,2.5V 10 25 C 8 6 4 2 0
ID, Drain Current (A)
VGS=1.5V
3 0
ID, Drain Current (A)
TJ=125 C 0.0 0.5 1.0
-55 C 1.5 2.0 2.5
0
0.2
0.4
0.6
0.8
VDS, Drain-to-Source Voltage (V) Figure 1. Output Characteristics
180 150 120 90 60 30 0 Ciss Crss 0 5 10 15 20 25 Coss 2.2 1.9 1.6 1.3 1.0 0.7 0.4 -100
VGS, Gate-to-Source Voltage (V) Figure 2. Transfer Characteristics
ID=7A VGS=4.5V
RDS(ON), Normalized RDS(ON), On-Resistance(Ohms)
C, Capacitance (pF)
-50
0
50
100
150
200
VDS, Drain-to-Source Voltage (V) Figure 3. Capacitance
1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 -50 VDS=VGS
TJ, Junction Temperature( C) Figure 4. On-Resistance Variation with Temperature IS, Source-drain current (A)
VGS=0V
10
1
VTH, Normalized Gate-Source Threshold Voltage
ID=250A
10
0
-25
0
25
50
75
100
125
150
10
-1
0.4
0.6
0.8
1.0
1.2
1.4
TJ, Junction Temperature( C) Figure 5. Gate Threshold Variation with Temperature
VSD, Body Diode Forward Voltage (V) Figure 6. Body Diode Forward Voltage Variation with Source Current
3
CEM8208
VGS, Gate to Source Voltage (V)
5 4 3 2 1 0 VDS=10V ID=7A 10
2
RDS(ON)Limit
1
ID, Drain Current (A)
10
1ms 10ms 100ms 1s DC
4
10
0
10
-1
0
1
2
3
4
5
6
10
-2
TA=25 C TJ=150 C Single Pulse 10
-2
10
-1
10
0
10
1
10
2
Qg, Total Gate Charge (nC) Figure 7. Gate Charge VDD t on V IN VGS RGEN G RL D VOUT td(on) VOUT
10%
VDS, Drain-Source Voltage (V) Figure 8. Maximum Safe Operating Area
toff tr
90%
td(off)
90% 10%
tf
INVERTED
90%
S
VIN
50% 10%
50%
PULSE WIDTH
Figure 9. Switching Test Circuit
Figure 10. Switching Waveforms
10
0
r(t),Normalized Effective Transient Thermal Impedance
D=0.5 0.2 0.1 0.05 0.02 0.01 PDM t1 t2
10
-1
10
-2
Single Pulse
10
-3
1. RcJA (t)=r (t) * RcJA 2. RcJA=See Datasheet 3. TJM-TA = P* RcJA (t) 4. Duty Cycle, D=t1/t2
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
Square Wave Pulse Duration (sec) Figure 11. Normalized Thermal Transient Impedance Curve
4


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